From microscopic crystals to the cornerstone of the intelligent world, unveiling the high-tech veil behind the wafer

In the torrent of the digital age, the term "wafer" has long been no longer limited to the professional terminology within the laboratory, but has become a key technology carrier that connects everything and drives the development of artificial intelligence. Whether it is a smart phone processor or the core component of a new energy vehicle power module, their birth is inseparable from this seemingly ordinary but infinite energy base material.

Silicon-based miracle tracing | Decoding the mystery of the microscopic universe behind wafer casting

a qualified wafer can not be achieved by simple cutting and polishing. it is the embodiment of human's ultimate control over the material world. The single crystal ingot formed by high temperature melting and then slowly stretching has a nearly perfect atomic arrangement structure, which is the key to determining the upper limit of the performance of the subsequent chip.

entering the nano-level processing stage, lithography technology is like an extremely accurate "molecular ballet". the circuit pattern on the mask is reduced by thousands of times and then accurately copied onto the negative. Each etching action needs to be performed with an accuracy on the order of an Emm, and a slight deviation may result in a whole batch of rejects.

As Moore's Law approaches the physical bottleneck, the industry is turning to new materials and new architectures for breakthroughs. FinFET three-dimensional transistor design, GAA surround gate process has come on stage, constantly refreshing people's understanding of the boundaries of semiconductor miniaturization.

Industry Pulse Monitoring Station | Deep Scanning of Global Wafer Supply Chain Dynamics and Market Competition Pattern

In recent years, the international situation has changed, making the wafer industry chain, which was originally globalized division of labor and cooperation, face unprecedented uncertainty tests. "TSMC-Samsung-Intel" three-strong competition situation is becoming more and more intense, who can take the lead in mass production in 3nm or more advanced nodes will become an important weight around the next decade of scientific and technological discourse.

At the same time, a number of local enterprises in mainland China have accelerated the pace of layout and gradually realized import substitution in mature process areas. At the same time, they are also actively promoting the blueprint planning for the construction of 12-inch large-size production lines.

Silicon carbide (SiC) and other third-generation semiconductor materials have attracted much attention due to their excellent thermal stability and high-frequency response capabilities. They are especially suitable for electric vehicle inverters, photovoltaic conversion and other fields, and are expected to open up a new high-performance Device road.

upstream equipment manufacturers have also made efforts to overcome the core technical barriers, from the Netherlands ASML high-end EUV lithography machine to introduce the difficulty of the background to force out of domestic deposition, testing equipment progress signal is increasingly strong.

On the other hand, advanced packaging technologies based on the idea of Chiplet small core stitching are overturning traditional SoC design concepts, or will redefine the next generation of system-level integration paths and shift the focus of development.

Application Scenarios Anatomy Room | Perspective Different Types of Wafers Drive the Multi-dimensional State of Modern Science and Technology Ecology

In the face of the huge wave of demand for the electrification transformation of the automotive industry, the investment in the 8-inch wafer production line dedicated to the manufacture of IGBT power components continues to heat up, marking a substantial advance in the construction of the local supply system for power electronic control components.

The special processing layers required for graphics processor units (GPU) and AI training cards often involve multiple complex passivation and copper plating processes. These details directly affect the concurrent operation efficiency performance and long-term operation reliability index of the final product.

When a large number of wireless sensor network nodes are deployed on the edge of the Internet of Things, it is necessary to try to reduce the static power consumption value per unit area, which puts forward higher-level requirements for the design of the underlying CMOS logic gates-that is, the pursuit of functional integrity must also take into account the principle of maximizing energy efficiency.

scientific research institutions are carrying out extensive experimental research on new two-dimensional electronic systems such as topological insulators, and expect to introduce its unique zero-resistance edge conduction properties into the construction of future quantum information processing devices, thus opening the prelude to the era of ultra-high-speed computing in the true sense.

Future Trend Watchtower | Looking Forward at the Possible Direction of Next Generation Wafer Innovation at the Technical Turning Point

Scientists have begun to evaluate the possibility that graphene and other transition metal chalcogenides are suitable for large-scale introduction into the production chain of flexible electronic products. If it is successfully commercialized, it means that the foldable display and wearable health monitor will usher in a new generation of basic platform support.

Combined with the power of biomedical engineering technology, researchers are trying to create a bionic cell membrane coating layer for neuromodulation devices implanted deep in human tissues to reduce the probability of immune rejection and extend the life cycle of related medical devices.

In order to meet the increasing mission complexity requirements of satellite communication payloads and deep space exploration equipment, special anti-irradiation enhancement measures have been put on the agenda to implement special research actions to ensure the stable operation of various integrated circuits in extreme space environments.

The entire manufacturing industry is moving towards a low-carbon circular economy. More and more fabs are committed to achieving zero emissions of water resources and reducing environmental load pressure by improving the reuse rate of waste raw materials.

In addition, the interdisciplinary talent training strategy is also regarded as a long-term move to revitalize the national microelectronics industry and be implemented and promoted. With the help of the close coordination mechanism between universities, scientific research institutes and leading enterprises, a group of talents with both theoretical literacy and practical experience are cultivated.