In this digital age, small chips carry huge amounts of energy. And the starting point of all this is the seemingly inconspicuous but extremely precise wafer. Today, let's walk into this wonderful world and uncover the mystery behind it.

From Sand to Chip: Uncovering the Secret of Wafer Birth

You may be surprised by the fact that the core element that underpins the modern electronics industry comes from one of the most ubiquitous substances in nature: silicon. This mineral, which is widely distributed in the earth's crust, has undergone a series of highly complex and precisely controlled operations before it has been transformed into the "wafer" of today ".

first, the original sand grains are smelted and purified to obtain elemental silicon rods close to the absolute purity level. Then a special mechanical arm is used to slowly stretch to form a crystal cylinder with continuous and uniform atomic structure, that is, the so-called Czochralski method is used to prepare silicon ingots. Finally, the diamond saw blade is used to divide it into standard circular slices with the thickness of cicada wings, which is the substrate version of the final product presented to us.

The secret weapon behind different sizes: full resolution of wafer specifications

at present, there are mainly two mainstream sizes in circulation on the market, namely, eight inches (about two hundred millimeters) and twelve inches (about three hundred millimeters caliper measurement), these two different diameter parameters directly affect the difference in the number of IC units within the maximum area that can be accommodated in the subsequent packaging process. There is a comparative relationship. It is worth noting that the larger the physical profile, the more batch processing tasks can be completed in the same time, thus significantly improving the overall work efficiency ratio. However, at the same time, it will also face many new technical obstacles that are difficult to overcome, such as the decline in yield due to edge effect. There is an urgent need for solutions to be improved by introducing countermeasures.

The big stage of the microscopic world: exploring how integrated circuits on wafers are formed

once it enters the real manufacturing stage, then it will involve several crucial core technical means to cooperate with each other to successfully complete each link in the whole process chain. whether the operation is in place or not determines the quality of the final output result.

for example, lithography technology is used to depict a preset pattern template pattern, and then use ultraviolet light irradiation to accurately project the image onto the coating coated with photosensitive material to leave corresponding trace marks as the next etching procedure reference basis. after the standard source base material is prepared, the chemical solution etching, dissolution, removal of excess parts, and the required shape outline feature lines are clear, clear, identifiable, easy to identify and correct to ensure that the expected results are safe and accurate. 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